ECE Seminar Series: Wednesday, January 29

Free Public Seminar - Wednesdays at 10:30 AM - Micron Engineering Center, Room 114

Featuring Randy K. Rannow, Engineering Director at Silverdraft Supercomputing and IEEE Boise Section Chair

Ethics, Privacy, Bias, Transparency, and Standards Development: A High-Performance Computing Perspective

With the ever-evolving use of artificial intelligence, ethics-related matters (privacy, bias, transparency) are surfacing as the speed of innovation (especially in high-performance computing) continues to increase. There are many complex ethics-related matters to be considered, including the various standards development organizations that have initiated activities to further explore ethics-related matters.

This presentation will provide an overview of a standard development process that adheres to fair and equitable processes, ensure the highest quality outputs, and reinforces the market relevance of standards. Specific IEEE standards activities related to Ethically Aligned Design will also be discussed.

SPEAKER BIO | Rannow has more than 25 years of professional experience in academia, industry, and aerospace/defense as an individual contributor and team leader. With a formal background in condensed matter physics, he has broad knowledge in product development and applied research and well as high volume manufacturing.

Electrical Engineering Research Team Develops New Transistor

The American Chemical Society (ACS) launched its new journal Applied Electronic Materials this year. One of Boise State’s own research teams landed a spot in the very first issue thanks to their novel work on a new type of transistor. “The new transistor opens up an exciting avenue of research,” says Dr. Kris Campbell, an associate professor in the Electrical and Computer Engineering Department. The featured work describes an optically-gated transistor developed in the Non-Volatile Memory research lab at Boise State University. Campbell’s research team includes undergraduate electrical engineering students Randall Bassine and Jeremy Astle and electrical and computer engineering doctoral student Faisal Kabir. Their unique work has led to a patent for Boise State University and has already been licensed by a company hoping to use the technology in their products. In this work, Dr. Campbell and her team demonstrate that a device comprised of alternating layers of sputtered amorphous c...

Dr. Maria Mitkova Honored by International Association for Advanced Materials

Maria Mitkova, a professor in the Electrical and Computer Engineering Department at Boise State University recently attended the 25th assembly of the Silver Jubilee Advanced Materials Congress held in Stockholm, Sweden. Mitkova was honored at the event, receiving the International Association for Advanced Materials (IAAM) medal. Dr. Maria Mitkova (left) Receives IAAM Medal Ea ch year IAAM recognizes high-impact research and innovations which promote the advancement of materials. Recognized by the IAAM for her outstanding contributions to the advancement of materials, Mitkova says she is proud to have received the award. “I have great opportunities to develop my research in a college known for its innovation, inclusion, and integrity,” Mitkova says, “where I am surrounded by a wonderful team of faculty and students.” Dr. Mitkova’s current research interests are in the area of chalcogenide glasses and thin film microstructures. Learn more about ongoing work onl...

ECE Seminar October 7: Printed Electronics for Air Force Applications

The Electrical and Computer Engineering Department at Boise State University invites you to attend a free public seminar hosted on Zoom. This week's seminar features Dr. Emily Heckman, a Senior Research Engineer at Air Force Research Laboratory. October 7 @ 10:30 am https://boisestate.zoom.us/j/92994002201 ABSTRACT | This talk will provide an overview of the field of printed electronics and ongoing research efforts in this area at the Air Force Research Laboratory Sensors Directorate. Printed electronics is a subset of additive manufacturing that uses technologies such as inkjet and aerosol jet printing and various other direct-write tools to additively print electronic devices on flexible, conformal and traditional substrate platforms. The AFRL Sensors Directorate is currently exploring this technology for application areas such as RF circuits and antennas, optoelectronic devices, sensors, and rapid prototyping. Challenges such as post-processing, repeat...

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